The VIA EPIA-E900 Pico-ITXe board brings the flexibility of the modular approach to single-board design, creating the most versatile platform for building a diverse range of ultra-small form factor devices for in-vehicle, industrial automation and a myriad of other vertical market applications. With the inclusion of a high-speed MXM connector interface, customers can quickly design custom Smart I/O expansion cards for their specific applications saving both cost and time-to-market.

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