VIA @ China International Industry Fair

The China International Industry Fair held in Shanghai last week gave us the ideal opportunity to introduce our new family of VIA Edge AI systems powered by the Qualcomm® Snapdragon 820E Embedded Platform that we are rolling out in Q4 this year.

At the VIA booth, we demonstrated all three of our new systems: the VIA ALTA DS 3; the VIA ARTiGO A920; and the VIA Mobile360 M820. In addition, we also had the VIA SOM-9X20 module, which is at the heart of the systems on display.

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