The China International Industry Fair held in Shanghai last week gave us the ideal opportunity to introduce our new family of VIA Edge AI systems powered by the Qualcomm® Snapdragon 820E Embedded Platform that we are rolling out in Q4 this year.
At the VIA booth, we demonstrated all three of our new systems: the VIA ALTA DS 3; the VIA ARTiGO A920; and the VIA Mobile360 M820. In addition, we also had the VIA SOM-9X20 module, which is at the heart of the systems on display.
