VIA @ OFweek 2018

We had a fantastic time during the OFweek 2018 event that took place in Shenzhen, China, on November 12-13, 2018. The conference was organized by China High-Tech Industry Portal OFweek and the China High-Tech Association.

During the event, we gave a presentation on the role of AI and edge computing in the future of the automobile industry. We have also offered the visitors a sneak peek at our brand new VIA Mobile360 M820 solution, which will be announced later this year.  

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